Draft ISO 14644-17: Particle deposition matters

Koos Agricola, a member of the international committee working on a new ISO standard that focuses on particle deposition rate, dissects the parameter that relates air cleanliness directly to the probability of surface contamination

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Review: Cleanroom Technology Conference 2019

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Micron completes Singapore NAND centre of excellence expansion

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Editor's comment: Hi-tech manufacturing steals the show

This month's issue looks at contamination control in hi-tech applications

Jim Polarine | STERIS Senior Technical Service Manager

Either chasing tornados or identifying microbial contamination, Polarine travels the world coaching how to put science ...

Supplier analysis for wafer fabrication

Even ultra-trace contamination can ruin an entire batch of microcircuits. That's about to change with new technology ...

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Chinese electronics company JCET begins high-volume wafer bumping

The line currently offers both lead-free and copper column bump types with bump pitches down to 40 μm possible