The US-based company has announced the expansion to house a new high-volume line of advanced packaging equipment
NHanced Semiconductors has announced that it is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment.
The new line will run in parallel with the existing prototyping and low volume production line.
The new line is expected to begin production in the second half of 2022, capable of constructing up to 10,000 3DIC wafer stacks per month. The expansion will also enable greater capacity for 2.5D interposer fabrication and die-to-wafer assembly. Domestic sourcing of these AP technologies is critical to aerospace/defence agencies and many US manufacturers.
"Demand for advanced packaging is just booming," said company President, Bob Patti. "We're at an inflection point. Our year-on-year revenue doubled in the first 5 months of 2021; many customers are ramping up volume production."