The UK company has doubled its ISO Class 6 and 7 cleanroom production area
L-R: Steve McMahon, Chief Commercial Officer; Nick Psaila, Chief Executive Officer; Mark Hesketh, Chief Operating Officer; David Jolliffe, Chief Financial Officer
Optoscribe has announced the release of its 3rd generation ultra-high-speed 3D photonic component manufacturing system and the expansion of cleanroom areas within its state-of-the-art facility in Livingston, UK.
Formed in 2010, Optoscribe uses unique laser direct write technology to manufacture glass-based integrated 3D photonic components for the telecommunications and data communications markets.
Optoscribe's new proprietary 3rd generation laser inscription system delivers 20 times faster throughput than the previous generations, the company said. The technology performs at high speed while maintaining the necessary precision levels required for single-mode components. This achievement is a significant advancement in the company’s capabilities.
The company has also increased its headcount by 50% over the past 18 months, having recruited skilled personnel in areas including photonic engineering, product development, and manufacturing.
Associated with the expansion of its manufacturing capacity the company has also doubled its Class 1,000 (ISO Class 6) and 10,000 (ISO Class 7) cleanroom areas and installed additional high-speed automated optical device testers.
"Following our last investment round in September 2018, I am delighted to see the continued improvements of our 3D laser inscription technology," commented CEO Nick Psaila.
This significant milestone, Psaila said, represents the completion of a commitment the company made to investors and customers to further expand its capability to support increased production volumes going forward.
"This progress is particularly timely with our ever-increasing levels of commercial engagement in datacentre photonics and other markets," Psaila concluded.
Optoscribe's 7,400 square feet facility comprises research and development laboratory, and a state-of-the-art manufacturing area including cleanrooms for wafer-scale processing, assembly and test.