ESCATEC adds to its cleanroom for micro- and optic-electronics
The Swiss contract manufacturer already has a ISO Class 7 facility
Electronics manufacturing services innovator, ESCATEC has added ISO Class 5 sections to its ISO Class 7 micro optic electronic manufacturing services (MOEMS) facility in Heerbrugg, Switzerland to address the growing demand for miniaturised electronics.
The facilities enable miniaturised electronics and sub-assemblies to be manufactured at levels of cleanliness and technological precision rarely available from a contract manufacturer. They are supported by the rest of the Group’s global operations that include the ability to ramp up to high volume manufacturing in Asia.
The MOEMS facility’s capabilities include Chip On Board (die bonding and wire bonding), encapsulation, Solder Flip Chip, Ball Grid Array, and micro-optics assembly. ESCATEC also has an extensive r&d department.
‘”Very few contract manufacturers are prepared to invest the significant sums required to set up and run a Class 7 cleanroom close to their customers in Europe,” said Gerhard Klauser, general manager at ESCATEC Switzerland. “We differentiate ourselves in the marketplace by focussing on quality and precision. This MOEMS facility enables us to manufacture microelectronic and optical assemblies in an ultra-clean environment to ensure the highest possible build quality and reliability. For one customer we even bought a special piece of equipment to make their product because no-one else could manufacture it to the standards that we were then able to.”
Examples of products that ESCATEC has manufactured in its MOEMS facility include laser sights for the military, rangefinders for surveying equipment, and camera assemblies.
