Micron Technology, a US producer of computer memory and data storage, has delayed the construction and opening of a $100bn semiconductor fabrication plant in Clay, New York.
Micron first announced efforts to deliver the wafer plant project in 2022, with the intention of building four large Dynamic Random-Access Memory (DRAM) wafer plants.
Construction for the facility was scheduled to begin in 2025 and has now been postponed for two-to-three years.
Once built, the Clay campus would become the largest US producer of DRAM for applications spanning AI, defence, cybersecurity, aerospace, and consumer electronics.
Micron released a final environmental impact statement on November 7, which showed a “potential revised” construction schedule, reflecting the delay in the opening of the first facility.
Micron’s EIS noted: “The first two DRAM manufacturing fabs (Fab 1 and Fab 2) are expected to be operational by 2029 and 2030, respectively, with the remaining fabs (Fab 3 and Fab 4) coming online in 2035 and 2041."
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