Doubles cleanroom space and opens new R&D labs and customer training centre at corporate hq
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has completed its expanded cleanroom IV facility at its corporate headquarters at St Florian am Inn, Austria.
The expansion is part of the company\'s long-term growth strategy to address high-volume tool orders and speed time to market for its customers worldwide.
EVG has doubled its cleanroom space for process development and pilot production services. It has also expanded its application labs, added new R&D facilities for internal tool development and testing, and opened a new training centre for customers and staff.
In addition the Group has increased its automated high-volume manufacturing (HVM) systems (for different wafer sizes) to strengthen its demonstration and process development capabilities.
Although manufacturing and product development are centralised in Austria, the company says technology and process development teams here work closely with the company\'s subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; Seoul, South Korea; and Chung-Li, Taiwan where additional application labs and cleanroom facilities are available for onsite customer demonstration and technology process development.
EVG works with universities and R&D institutes worldwide to contribute to the most advanced research for semiconductors, MEMS, light emitting diodes (LEDs) and other high-tech devices.
Earlier this year, the addition of an ultra-modern manufacturing facility doubling the production floor space marked the completion of the first phase of EVG\'s long-term expansion plans. The company increased its order intake in fiscal year 2012 (ended 30 September 2012) by 5% over 2011 and increased its revenue by 20% within the same period.
More than 100 new employees have joined the company in the last 12 months, taking the total to approximately 600 worldwide.