International SubFAB Research Labs (ISRL USA) and AI Infrastructure Partners (AIIP) have signed a memorandum of understanding to develop a semiconductor subfab R&D facility in the US.
The platform aims to address a gap in semiconductor infrastructure by providing a dedicated environment for subfab research, with a focus on improving sustainability and reducing environmental impact.
The subfab is the infrastructure layer beneath the cleanroom, responsible for critical process support functions including vacuum pumping, gas abatement and chemical waste management.
Why is subfab infrastructure important?
Subfab infrastructure underpins cleanroom operations and is essential to high-volume semiconductor production, but also accounts for a significant share of the sector’s environmental impact.
The proposed facility will replicate high-volume manufacturing conditions using both legacy and advanced process tools, enabling testing and validation of subfab technologies in a fully instrumented environment.
Shared R&D model
Under the agreement, AIIP will design, build and own the facility, while ISRL USA will lead technical operations and manage research programmes through an industry-neutral, multi-member model.
The platform will operate on an Infrastructure-as-a-Service (IaaS) basis, allowing semiconductor manufacturers, equipment suppliers and materials companies to access shared infrastructure for pre-competitive R&D.
Programme areas are expected to include materials reclaim, next-generation abatement systems, equipment validation and workforce development.
Reducing cost and risk
The partners state that the shared model is designed to reduce reliance on private pilot lines, which can exceed $100m, by offering access to subfab infrastructure at lower cost and risk while maintaining IP-protected research environments.
The facility will support a broad ecosystem including independent device manufacturers (IDMs), foundries, OEMs, subfab suppliers and research institutions.
Next steps
The MOU establishes a framework for final agreements and site selection, which are currently underway.
The project is structured to align with funding mechanisms, including the CHIPS Act and regional economic development programmes.
Operational readiness is targeted within 12 months of full funding, with ISRL USA inviting industry participation through membership and research programmes.
“This MOU is a defining moment for ISRL USA and the semiconductor industry…Together, we are building a platform where manufacturers, OEMs and innovators can collaborate on sustainability challenges that no single company can tackle alone,” said Scott Balaguer, CEO of ISRL USA.