UMC breaks ground for Fab 12A Phase 5 & 6

Published: 8-Jun-2012

The Taiwanese facility will be used to provide new generation of 300mm fab services


Global semiconductor foundry, United Microelectronics Corporation (UMC) has broken ground for its 300mm Fab 12A Phase 5 & 6 (P5 & P6) at its Tainan, Taiwan fab complex. The expansion begins UMC's new generation of 300mm manufacturing that will extend 28nm production and establish a solid foundation for 20nm and beyond.

UMC has operated in the Tainan Science Park since November 1999, when Fab 12A was established as Taiwan's first 300mm fab. The state-of-the-art P5 & P6 will provide advanced 28nm, 20nm, and 14nm capacity, and is scheduled for equipment move-in during the second half of 2013. Total cleanroom area is 53,000m2, about the size of 10 American football fields. P5 & P6 are planned to create 2,600 jobs and to contribute 50K wafers per month, bringing total monthly design capacity for Fab 12A to 130K wafers.

With the planned P7 & P8, the eight phase fab complex will have a total design capacity of 180K wafers per month.

Stan Hung, chairman of UMC, said, “UMC remains optimistic about the long-term outlook of the semiconductor and foundry industries. However, with increasing industry volatility, a clearly defined business strategy is needed in order to take full advantage of upcoming market opportunities.”

Cumulative capex for UMC's Fab 12A phases 1-4 is projected to reach US$ 8bn, with P5 & P6 to add nearly US$ 8bn more. There are further plans for P7 & P8.

The P5-P8 fab complex will be characterised by close partnerships with customers and vendors to align with their technology roadmaps, enabling customers to introduce their future products while propelling UMC growth.

www.umc.com

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