Great demand for Leica macro inspection systems
Various leading semiconductor manufacturers in Europe, the US and Asia have ordered a series of automated defect-detection and classification systems for 200mm and 300mm production, totalling €12 m from the Leica Microsystems Microelectronics Business Unit.
Headquartered in Wetzlar, Germany, Leica Microsystems is a leading global innovator, manufacturer and supplier of high precision optical solutions based on microscopes and related instruments; and manufactures a comprehensive portfolio of products used in a wide variety of applications, in areas such as life-sciences, industrial inspection and the semiconductor manufacturing industry. Only six months after market launch, the LDS3000 and LDS3300 macro inspection systems are claimed to rank among the preferred worldwide systems for automated defect detection and classification in the chip industry. Seventeen systems have been installed in chip factories, and with orders on hand as well as expected follow-up orders, the number is expected to rise to approximately 40 systems by the end of 2005. The application field is primarily defect monitoring in photolithography, directly after coating, exposing or processing. Product manager Thomas Groos attributes the increasing use of these systems in chip manufacturing to the "excellent detection performance and unprecedented service and support". Another argument lies in the compact, modular design of this process control system, which enables easy integration into automated 200mm and 300mm wafer fabrication. In the spring of 2005, Leica Microsystems will be following the LDS series with a new system that combines micro and macro defect detection for simultaneous use, thus illustrating the company's dedication to meeting semiconductor manufacturers' demands for higher productivity and optimised cost of ownership.