Intel has begun equipment installation at its Fab 62 semiconductor manufacturing facility at its Ocotillo campus in Arizona, as construction progresses towards a planned operational date of late 2028.
The facility will be the sixth high-volume manufacturing plant at the Ocotillo campus and is expected to use Intel’s 1.4-nanometre-class Intel 14A process technology.
Naga Chandrasekaran, Executive VP and Chief Technology and Operations Officer of Intel Foundry, confirmed on 22 October that construction and equipment installation were under way at the site.
Intel began construction of Fab 62 and the neighbouring Fab 52 facility in 2021.
Fab 52 was completed in 2023 and has been producing chips using Intel’s 18A process since late 2025.
The Intel 18A process combines RibbonFET transistor architecture with PowerVia backside power delivery technology.
Updates across US manufacturing sites
Intel also provided updates on its other US semiconductor manufacturing projects.
In New Albany, Ohio, the company has installed the first major roof truss at its planned $28bn semiconductor plant.
The facility, initially scheduled for completion in 2025, is now expected to be completed in 2030 following funding difficulties.
In Oregon, Intel plans to deploy high-numerical-aperture extreme ultraviolet (High NA-EUV) lithography equipment for mass production.
The site will support research and development and manufacturing of advanced logic semiconductors, including 3D interconnect technology.
Intel is also conducting advanced packaging research and development, back-end assembly and testing at its Arizona campus.
In New Mexico, the company is undertaking large-scale advanced packaging production.
Construction has also begun on a new mask manufacturing facility in Santa Clara, California.
(Photo credit: Intel Corporation)
