Axis Electronics to open cleanroom in new Bedford facility

Published: 20-Jan-2010

Axis Electronics is to open a class 10,000 cleanroom at its new microelectronic facility in Bedford, UK, which from March will be offering microelectronic assembly services including manual/automatic die bonding and manual/automatic wire/tape bonding, both as part of multichip module (MCM) and chip on board (COB) style assemblies. Included in the service will be a bespoke and prototype microassembly capability.

The cleanroom, with temperature and humidity controls, will house equipment for a range of applications including: a die handling robot, two automatic wire bonders, three semi-automatic bonders, one manual ball bonder, a pull/shear tester, as well as two environmental chambers.

Axis Electronics’ engineering manager Matt Turner will head the cleanroom after previously holding a similar position at Texas Instruments.

“We are very fortunate to have skilled people locally who have excellent experience using the exact equipment and processes,” he said.

Axis Electronics is a UK provider of contract electronic manufacturing services ranging from PCB assembly through to full turnkey Box build.

Contact Axis Electronics T +44 1234 342932 F +44 1234 364941 {encode="sales@axis-electronics.com" title="sales@axis-electronics.com"} www.axis-electronics.com

You may also like