New generation of Digisel arrives

Published: 2-Feb-2005


Horiba Jobin Yvon has introduced the second generation of the Digisel, its high precision laser ellipsometer specifically designed for real-time, in situ monitoring and control of thin film deposition or etch processes. The latest Digisel features a flexible Windows-based software package, and includes convenient routines for daily work as well as advanced process control functionality and reliable ellipsometric data, along with real-time calculations of the thickness and refractive index of single layer films in situ. The Digisel is fully integrated, simple to operate and highly adaptable to many types of processes, and can be used either as a standalone instrument or in combination with other Horiba Jobin Yvon metrology equipment to meet application-specific requirements. The in situ laser ellipsometry technique is suitable for thickness monitoring, growth and etch rates, endpoint detection, surface damage and contamination.

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