Semicon Europa 2003 preview

Published: 12-Mar-2003


Munich, Germany, 31st March -3 April 2003

More than 800 companies will display the latest manufacturing technologies for semiconductors, flat panel displays (FPDs) and micro-electromechanical systems (MEMS) at SEMICON Europa 2003, to be held April 1-3 at the New Munich Trade Fair Center in Munich, Germany. In conjunction with the exhibition, five days of technical conferences, business programmes and international standards meetings will run from March 31 to April 5 at the Munich International Congress Center (ICM). The organisers say MEMS technology, which shares common manufacturing processes with semiconductors, will be a highlight of the exposition. The one-day International MEMS/MST Forum on March 31 will focus on opportunities and challenges in the production and commercialisation of MEMS products. SEMICON Europa will also host one MEMS standardisation meeting. In addition, MEMS manufacturing technology will be featured in a special exhibit, the MEMS Manufacturing Technologies Platform, located in Hall A2. For the flat panel display community, the SEMICON FPD Conference on April 3 will feature technical and business sessions on the automotive display market, FPD manufacturing strategies and the global and European outlook. A panel discussion will address the role of Europe as both a user and producer of displays and the prospects for next generation display products. The Fab Managers Forum, now in its 7th year and held annually in conjunction with SEMICON Europa, will take place in Dresden, Germany on April 4. Other programme highlights during the week include the 5th European Manufacturing Test Conference on March 31; the Advanced Packaging Conference on March 31; the 14th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) on March 31-April 1; and the SEMI Market Briefing on April 1. The event also serves as the industry venue to advance manufacturing standards. More than 40 SEMI International Standards events, including task force meetings, technical committee meetings and Standards Technical Education Programs (STEP) will be held during the event.

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