Shellcase opens $8 million facility
Shellcase, a developer and provider of Wafer Level Chip Size Packaging (WLCSP), has opened its $8 million expanded production facility in Jerusalem with 15,000 square feet of ISOclass 100 and ISO class 10,000 cleanrooms.
The expansion commenced in May 2001 following the successful closing of a $20 million private placement in April 2001. The new facility, for processing both 6" and 8" semiconductor silicon wafers and packaging them in Shellcase's innovative miniaturisation packaging technologies, is expected to increase productivity three fold by the end of 2002. "This investment affirms our commitment to continually provide our clients with the capacity to accommodate future growth," according to Shlomo Oren, Shellcase's President and CEO. "This larger facility, with state-of-the-art manufacturing equipment, provides Shellcase with significant competitive advantages with regard to cost-per-wafer, yield and overall productivity."