Applied Materials receives $45 million orders from Tower Semiconductor

Published: 1-Nov-2002


Applied Materials, Inc. have announced that it has received orders for chipmaking equipment worth more than $45 million from Tower Semiconductor Ltd., an independent wafer-foundry located in Migdal Haemek, Israel. Tower plans to use the equipment for the production of 0.18 micron and 0.13 micron CMOS digital logic, mixed signal, flash memory and image sensor devices in its new Fab 2 facility. When Fab 2 is complete, Tower plans to offer 0.18 micron and below process technologies, produce up to 33,000 200mm wafers per month and employ approximately 1,100 people. Tower Semiconductor's order specified multiple PVD (physical vapour deposition), RTP (rapid thermal processing), etch, HDP-CVD (high-density plasma chemical vapor deposition), WCVD (tungsten chemical vapour deposition), SACVD (sub-atmospheric chemical vapour deposition), wafer inspection and defect review systems.

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