Fujitsu's facility to construct logic chips

Published: 13-Apr-2004


Fujitsu is to construct a new facility at its Mie semiconductor plant in central Japan to mass-produce logic chips on a 90nm 300mm volume process technology as well as next-generation 65nm technology. The new facility, with 12,000m2 cleanroom area, is scheduled to become operational in April 2005, with volume shipments to start September 2005 when demand for 90nm products is expected to intensify. To avoid risk from potential earthquake damage and ensure operational stability for its customers, Fujitsu says that it will be the first in the industry to equip its new fab building with micro vibration control and a seismically isolated structure. The company will initially invest about €0.58bn for the first phase of construction up to fiscal 2005. Phase two and subsequent investment will be made in stages, taking into account market demand. Total investment in the facility is expected to reach about €1.26bn. When fully equipped, it will have a maximum capacity of 13,000 wafers per month. The current facility produces 11,000 wafers/ month with 0.18micron and 0.13micron processes. The 90nm technology has been developed at Fujitsu's Akiruno Technology Center and has been shipping 90nm products since January 2003 both internally and to outside customers. The process has copper wiring and low-k technologies.

T: +81 35322 3323 edevice@fujitsu.com

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