New compounds provide ultra clean plastics for the semicon industry
The semiconductor industry constantly strives to fit more functionality onto existing integrated circuits, or “chips”. The next generation of chip manufacture is a photo-lithography process using argon-fluoride (ArF) laser technology. However, adoption of ArF lasers has been delayed by the lack of sufficiently “clean” plastics used in protective containers (photomasks and reticles) for the chip manufacturing process.
Now SABIC Innovative Plastics’ LNP Specialty Compounds business has developed the Ultra-Pure Transparent (UPT) Stat-Loy 63000CT series of compounds suitable for photomask and wafer protection devices, chip boxes, MEMS cases, reticle pods, and processing carriers.
Used in wafer protection devices, UPT Stat-Loy compounds can prevent damage from outgassing that can contaminate wafers, increase rejects and raise costs.
Chip manufacture demands stringent cleanroom procedures. As pitches become finer, the effect of contaminants from plastic outgassing is more pronounced. If volatile organic compounds (VOCs) or leachable ions reach the surface of silicone wafers, photomasks or reticles, they can damage the device or disrupt functionality. The use of higher-powered ArF lasers makes wafers and containers even more susceptible to damage from outgassing.
“The inadequacies of available container materials impeded the move to ArF laser light for years,” said Yeo Aun Hua, LNP product manager, SABIC Innovative Plastics. “Recognising that upgrading to this new technology is critical for integrated circuit manufacturers, SABIC Innovative Plastics proactively developed the UPT Stat-Loy 63000CT compounds to help remove a major hurdle in the miniaturisation of components.”
Under the brand TAC Carrier, Sakase Chemical Co has developed new containers for shipping non-JEDEC-standard components, including precision, micro-parts and thin film integrated circuit chips, which are often difficult to handle due to their design and shape.
According to Ikuo Konishi, general manager of the Development Division, “combining the Stat-Loy 63000CT compound – which provides antistatic properties and ultra purity – and the adhesive agent from Kaneka, enabled us to develop a new product line for difficult-to-handle, non-JEDEC standard components such as MEMS, lenses, chips and wafers with extremely low risk of contamination. We installed a cleanroom for commercialisation of UPT and Kaneka material and will start manufacturing these newly developed shipping cases for leading engineering manufacturers in Japan.”